Lite-On Technology has been granted a patent for an assembly structure of a transformer and a circuit board. The structure includes a circuit board, a packaging chip, a transformer, a first conductive plate, a second conductive plate, and a first heat sink. The first heat sink is connected to the packaging chip and the first conductive plate, and is disposed on the circuit board. The patent also claims that one end of the first heat sink extends downward to be inserted in and connected to the circuit board, and the packaging chip is attached to the first heat sink in a direction perpendicular to the circuit board. GlobalData’s report on Lite-On Technology gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Lite-On Technology, micro-LED wearables was a key innovation area identified from patents. Lite-On Technology's grant share as of September 2023 was 72%. Grant share is based on the ratio of number of grants to total number of patents.
Assembly structure of transformer and circuit board with heat sink
A recently granted patent (Publication Number: US11778746B2) describes an assembly structure of a transformer and a circuit board. The structure includes a circuit board, a packaging chip, a transformer, a first conductive plate, a second conductive plate, and a first heat sink. The first conductive plate is connected to the transformer's first output electrode, while the second conductive plate is connected to the transformer's second output electrode and the circuit board. The first heat sink is connected to the packaging chip and the first conductive plate, and it extends downward to be inserted in and connected to the circuit board. The packaging chip and the first heat sink are oriented perpendicular to the circuit board.
The assembly structure also includes electrical contacts between the circuit board and the second conductive plate and packaging chip. The packaging chip is a rectifier chip that contacts the circuit board through multiple pins and is electrically isolated from the first heat sink. Additionally, the structure may include a third output electrode connected in parallel with the first and second output electrodes, a third conductive plate connected to the third output electrode, and a third heat sink connected to the third conductive plate and the packaging chip or another packaging chip.
The first conductive plate and the second conductive plate have specific configurations. The first conductive plate includes a body portion connected to the first output electrodes, an end connected to the first heat sink, and another end extending outward from the body portion. The second conductive plate includes a body portion connected to the second output electrodes, an end connected to the circuit board, and another end extending outward from the body portion. The transformer can be positioned on the circuit board with its top surface facing away from or towards the circuit board.
The assembly structure also includes various locking mechanisms to secure the first conductive plate and the first heat sink together, such as a screw rod and nut or a threaded rod inserted into screw holes. In some embodiments, the first conductive plate and the first heat sink can be combined to form an integral metal plate.
Overall, this patent describes an assembly structure that provides efficient electrical connections and heat dissipation for a transformer and a circuit board. The specific configurations and locking mechanisms ensure secure and reliable operation.
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