Marvell Technology has been granted a patent for a laser chip designed for flip-chip bonding to a silicon photonics chip with passive alignment features. The chip includes an active region aligned away from the waveguide towards the bonding site, ensuring precise positioning for optimal performance. GlobalData’s report on Marvell Technology gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Marvell Technology, Network virtualization was a key innovation area identified from patents. Marvell Technology's grant share as of January 2024 was 79%. Grant share is based on the ratio of number of grants to total number of patents.
Laser chip for flip-chip bonding with passive alignment features
A recently granted patent (Publication Number: US11888286B2) discloses a laser chip designed for flip-chip bonding to a silicon photonics chip, featuring an active region aligned away from the waveguide towards the bonding site on the silicon photonics chip. The laser chip includes stoppers that ensure proper alignment, reducing optical loss during coupling between the active region and the waveguide to less than or equal to 3 dB. Additionally, alignment marks and a metal film aid in aligning the active region relative to the waveguide, enhancing the efficiency of the bonding process.
Furthermore, the laser chip design includes a front facet facing the waveguide, with the active region positioned between an n-type doped region and a narrower p-type doped region. The stoppers extend from the n-type doped region parallel to the p-type doped region, ensuring precise alignment during bonding. The inclusion of alignment marks and a metal film shared with the front facet further enhances the accuracy of aligning the active region relative to the waveguide, contributing to improved performance and reliability of the laser chip for flip-chip bonding applications in silicon photonics technology.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
