Powertech Technology has patented a package structure with a base, chip, control element, and underfill. The chip has a recess with a bottom surface and sidewall, where the control element is placed. The chip and control element are electrically connected to the base. GlobalData’s report on Powertech Technology gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Powertech Technology, Under-screen biometric identification was a key innovation area identified from patents. Powertech Technology's grant share as of January 2024 was 55%. Grant share is based on the ratio of number of grants to total number of patents.
Package structure with chip, control element, and underfill
A recently granted patent (Publication Number: US11848318B2) discloses a package structure designed for electronic components. The structure includes a base with a chip mounted on it, featuring a recess with a surface and sidewall. A control element is positioned between the base and the chip, with an underfill material filling the recess. The chip and control element are electrically connected to the base individually, ensuring efficient functionality and stability.
Furthermore, the patent details a manufacturing method for this package structure. It involves forming trenches on a wafer, attaching control elements to the bottom surface of the trenches, and then sawing the wafer to create individual package units. These units, each comprising a chip and control element, are placed on a base and filled with an underfill material. The method also includes using die attach film and adhesive layers for secure attachment, with specific thickness ranges specified for optimal performance. Additionally, the process involves the use of different materials for the adhesive layer and underfill, ensuring a robust and reliable package structure for electronic devices.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
