Semtech has patented a semiconductor device with stacked protection circuits to enhance ESD current discharge capability. The device includes multiple semiconductor dies with TVS diodes interconnected to protect against transient electrical signals. The innovative design allows for increased protection in semiconductor packages. GlobalData’s report on Semtech gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Semtech, Adaptive video coding was a key innovation area identified from patents. Semtech's grant share as of February 2024 was 56%. Grant share is based on the ratio of number of grants to total number of patents.
Semiconductor device with stacked protection circuits for esd discharge
A recently granted patent (Publication Number: US11881476B2) discloses a semiconductor device designed to protect a separate semiconductor package from transient electrical signals. The device comprises a leadframe with two semiconductor dies, each containing a transient voltage suppression (TVS) diode, coupled in parallel between the leadframe terminals. An encapsulant covers the leadframe and dies, ensuring the routing of transient signals through the TVS diodes for protection. Additional features include conductive bumps for bonding the semiconductor dies and the formation of conductive vias and contact pads for electrical connections.
Furthermore, the patent describes variations of the semiconductor device, such as configurations with multiple TVS diodes in parallel, solder bumps between dies, and thermocompression bonding methods. The devices are designed with exactly two electrical terminals and are capable of safeguarding against transient voltages. The incorporation of conductive vias and encapsulation over the semiconductor dies enhances the protective capabilities of the device. Overall, the patent highlights the innovative design of semiconductor devices with TVS diodes to ensure the protection of sensitive electronic components from potentially damaging transient electrical signals, showcasing advancements in semiconductor technology for improved reliability and performance in electronic systems.
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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
