Siliconware Precision Industries has patented a method for manufacturing a carrying substrate with increased routing area. The substrate includes circuit components embedded in an encapsulation layer, connected to conductive pillars, and a second circuit structure. This innovation aims to improve yield and reduce manufacturing costs for package substrates. GlobalData’s report on Siliconware Precision Industries gives a 360-degree view of the company including its patenting strategy. Buy the report here.

According to GlobalData’s company profile on Siliconware Precision Industries, was a key innovation area identified from patents. Siliconware Precision Industries's grant share as of February 2024 was 78%. Grant share is based on the ratio of number of grants to total number of patents.

Carrying substrate with circuit component encapsulated for increased routing area

Source: United States Patent and Trademark Office (USPTO). Credit: Siliconware Precision Industries Co Ltd

A recently granted patent (Publication Number: US11923337B2) discloses a carrying substrate for electronic packages. The substrate includes a first circuit structure with a circuit component bonded to one side, encapsulated by an encapsulation layer, and connected to a second circuit structure. The circuit component can be a package substrate or a coreless circuit structure, with conductive bodies connecting it to the first circuit structure. Additionally, conductive pillars are present in the encapsulation layer, electrically connecting the first and second circuit structures. The patent also covers methods for manufacturing the carrying substrate, involving the placement of electronic components, conductive pillars, and encapsulation layers to create a functional electronic package.

Furthermore, the patent extends to electronic packages incorporating the described carrying substrate, with provisions for various electronic components such as active elements, passive elements, or a combination thereof. The electronic package may also include conductive elements and a heat sink for thermal management. The methods outlined in the patent for manufacturing the carrying substrate emphasize the importance of proper electrical connections and encapsulation for the reliable operation of electronic packages. Overall, the patent aims to protect the innovative design and manufacturing processes involved in creating efficient and functional electronic packages using the disclosed carrying substrate.

To know more about GlobalData’s detailed insights on Siliconware Precision Industries, buy the report here.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.