STMicroelectronics has patented leadless semiconductor packages with improved wettable flanks to enhance solder fillet formation on substrates. The method involves forming die pads, positioning dies, creating conductive leads, encapsulating, applying adhesive, and forming a conductive layer. This innovation enables easy detection by inspection systems. GlobalData’s report on STMicroelectronics gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on STMicroelectronics, Quantum dot devices was a key innovation area identified from patents. STMicroelectronics's grant share as of February 2024 was 69%. Grant share is based on the ratio of number of grants to total number of patents.
Leadless semiconductor packages with improved wettable flanks for solder fillets
A recently granted patent (Publication Number: US11929259B2) discloses a method for packaging electronic components, such as dies, using conductive leads and encapsulation material. The method involves forming die pads, positioning dies on the pads, and electrically coupling the dies to conductive leads. Encapsulation material is then formed over the components, with an adhesive layer and a conductive layer added to the conductive leads. The process includes removing parts of the encapsulation material and utilizing a conductive adhesive layer for electrical coupling between the leads.
Furthermore, the patent describes a method for forming packages with multiple dies, conductive leads, and encapsulation material. The process involves separating portions of the conductive leads, positioning the packages on a conductive plate, and forming a conductive layer on the leads. Additional steps include separating the packages, removing the conductive plate, and forming an adhesive layer for coupling the packages. The method emphasizes the use of coplanar surfaces for the conductive leads and encapsulation material, along with an electroplating process for forming the conductive layer. Overall, the patent details a comprehensive approach to packaging electronic components efficiently and effectively.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
