Tokyo Seimitsu has been granted a patent for a measurement device that includes a probe, scale, scale head, and arm part. The device ensures accurate measurements by considering thermal expansion coefficients. The patent claims the device must satisfy a specific condition related to these coefficients. GlobalData’s report on Tokyo Seimitsu gives a 360-degree view of the company including its patenting strategy. Buy the report here.
Smarter leaders trust GlobalData
According to GlobalData’s company profile on Tokyo Seimitsu, Welding robots was a key innovation area identified from patents. Tokyo Seimitsu's grant share as of February 2024 was 48%. Grant share is based on the ratio of number of grants to total number of patents.
Measurement device with swinging probe and scale for surface measurement
A recently granted patent (Publication Number: US11859969B2) discloses a novel measurement device designed to accurately measure the surface of an object. The device comprises a probe part with a probe that swings around a center, a scale to measure displacement, a scale head to read scale marks, and an arm part to which the probe is attached. The patent specifies a condition that must be satisfied based on the thermal expansion coefficients of the probe, arm, and scale components to ensure accurate measurements. Additionally, the scale is described as a circular arc scale formed in a circular arc shape along the swing direction of the arm part. The patent also allows for adjustments in materials and lengths of components to meet the specified condition.
Furthermore, the patent details a measurement device with additional features such as a temperature sensor to measure ambient temperature and a controller to calculate the actual displacement of the probe's distal end. The controller utilizes specific expressions based on the thermal expansion coefficients of the components, the measured displacement value, and the change in ambient temperature during measurement to calculate the accurate displacement. This innovative device aims to provide precise measurements by considering the effects of thermal expansion on the components, ensuring reliability and accuracy in various measurement applications. The patent highlights the importance of maintaining specific conditions related to thermal expansion coefficients to enhance the performance and accuracy of the measurement device.
To know more about GlobalData’s detailed insights on Tokyo Seimitsu, buy the report here.
Premium Insights
From
The gold standard of business intelligence.
Blending expert knowledge with cutting-edge technology, GlobalData’s unrivalled proprietary data will enable you to decode what’s happening in your market. You can make better informed decisions and gain a future-proof advantage over your competitors.
GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
