Tokyo Seimitsu has been granted a patent for a measurement device that includes a probe, scale, scale head, and arm part. The device ensures accurate measurements by considering thermal expansion coefficients. The patent claims the device must satisfy a specific condition related to these coefficients. GlobalData’s report on Tokyo Seimitsu gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Tokyo Seimitsu, Welding robots was a key innovation area identified from patents. Tokyo Seimitsu's grant share as of January 2024 was 34%. Grant share is based on the ratio of number of grants to total number of patents.
Measurement device with swinging probe and scale for surface measurement
A recently granted patent (Publication Number: US11859969B2) discloses a novel measurement device designed to accurately measure the surface of an object. The device comprises a probe part with a probe that swings around a center, a scale to measure displacement, a scale head to read scale marks, and an arm part to which the probe is attached. Crucially, the device ensures precision by satisfying a specific condition related to the thermal expansion coefficients of its components. The patent emphasizes the importance of maintaining a balance between the thermal expansion coefficients of the probe part, arm part, and scale to achieve accurate measurements.
Furthermore, the patent details the inclusion of a circular arc scale, the adjustment of materials and lengths of components to meet thermal expansion requirements, and the incorporation of a temperature sensor and controller to calculate actual displacement based on measured values and ambient temperature changes. By integrating these features, the measurement device aims to provide reliable and precise measurements even in varying temperature conditions. This patent highlights the innovative approach taken to address the challenges posed by thermal expansion in measurement devices, offering a solution that ensures accuracy and consistency in surface measurements.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
