Zhen Ding Technology has been granted a patent for a circuit board design with multiple layers including signal layers, connection pillars, and coils. The innovative design features varying sheet resistances in different layers for improved performance. GlobalData’s report on Zhen Ding Technology gives a 360-degree view of the company including its patenting strategy. Buy the report here.

According to GlobalData’s company profile on Zhen Ding Technology, Under-screen biometric identification was a key innovation area identified from patents. Zhen Ding Technology's grant share as of January 2024 was 50%. Grant share is based on the ratio of number of grants to total number of patents.

Multilayer circuit board with varying sheet resistances

Source: United States Patent and Trademark Office (USPTO). Credit: Zhen Ding Technology Holding Ltd

A recently granted patent (Publication Number: US11871526B2) discloses a circuit board design comprising multiple layers for enhanced functionality. The circuit board includes a substrate with a base layer, a first metal layer, and a seed layer. The layers are utilized in constructing various circuit layers, such as signal layers, connection pillars, and coils, each serving a specific purpose within the circuit board. Notably, the sheet resistance of the first metal layer is specified to be larger than that of the seed layer, indicating a deliberate design choice for optimal performance.

Furthermore, the patent details the materials used in the construction of the circuit board, including options for the base layer such as polyimide, liquid crystal polymer, polyethylene terephthalate, and polyethylene naphthalate. The first metal layer is described as a combination of Ni-P or NiCr oxide, while the second metal layer is identified as Cu. Additionally, the thicknesses of the various layers are specified, with the coil thickness set to be greater than 50 µm. These design elements contribute to the overall functionality and efficiency of the circuit board, showcasing innovative advancements in circuit board technology.

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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.

GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.