AUO has been granted a patent for a method to inspect substrate flatness. The process involves selecting inspecting points, calculating measurement length and flatness index, and determining substrate qualification based on set thresholds. This innovation aims to ensure high-quality substrates in manufacturing processes. GlobalData’s report on AUO gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on AUO, Under-screen fingerprint recognition was a key innovation area identified from patents. AUO's grant share as of May 2024 was 80%. Grant share is based on the ratio of number of grants to total number of patents.
Method for inspecting substrate flatness using optical dimension measuring device
A recently granted patent (Publication Number: US12000693B2) discloses a method for inspecting the flatness of a substrate using an optical dimension measuring device. The method involves selecting inspecting points along straight lines in both X and Y directions, measuring heights at these points, calculating measurement lengths and flatness indices based on the collected data. If the calculated flatness index exceeds a predetermined threshold, the substrate is deemed unqualified and scrapped.
Furthermore, the method includes additional steps such as selecting inspecting points along a second straight line perpendicular to the first direction, calculating a second measurement length and flatness index, and determining the qualification of the substrate based on the second threshold. The patent also specifies criteria for identifying a substrate as qualified based on the calculated flatness indices. Additionally, the patent outlines specific parameters such as the distance between inspecting points and the threshold values for flatness indices to ensure accurate inspection results. Overall, the method provides a systematic approach to assess the flatness of substrates using optical measurement devices, enhancing quality control processes in manufacturing environments.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
