Data Insights
Amkor Technology gets grant for semiconductor device with lead structure and encapsulation
Amkor Technology's patent involves an electronic device with a unique substrate design, conductive structure, and encapsulation method. The semiconductor device...
Amkor Technology gets grant for thin semiconductor device with enhanced edge protection
Amkor Technology has been granted a patent for a thin semiconductor device with improved edge protection. The device includes a...
Amkor Technology files patent for semiconductor device with vertical interconnect in lid structure
Amkor Technology. has filed a patent for a semiconductor device with a substrate, electronic component, lid structure, and vertical interconnect....
Amkor Technology gets patent grant for packaged electronic device with conductive clip and exposed surfaces
Amkor Technology has been granted a patent for a method of forming packaged electronic devices. The method involves attaching semiconductor...
Amkor Technology files patent for fingerprint sensor device with extended bond wire
Amkor Technology has filed a patent for a fingerprint sensor device and a method of making it. The device includes...