Applied Optoelectronics. has been granted a patent for an optical transceiver featuring a housing, an optical communication module with components on opposite sides of a substrate, and a heat dissipation module with spaced heat conductive components, ensuring effective thermal management for the optical components. GlobalData’s report on Applied Optoelectronics gives a 360-degree view of the company including its patenting strategy. Buy the report here.

According to GlobalData’s company profile on Applied Optoelectronics, Quantum key distribution was a key innovation area identified from patents. Applied Optoelectronics's grant share as of June 2024 was 63%. Grant share is based on the ratio of number of grants to total number of patents.

Optical transceiver with heat dissipation module

Source: United States Patent and Trademark Office (USPTO). Credit: Applied Optoelectronics Inc

The patent US12013583B2 describes an innovative optical transceiver designed to enhance thermal management and performance in optical communication systems. The transceiver features a housing that accommodates an optical communication module, which includes a substrate and two optical communication components positioned on opposite surfaces of the substrate. A key aspect of the design is the heat dissipation module, comprising two heat conductive components that are in physical contact with the substrate. These components are strategically spaced apart, allowing for effective thermal contact with the optical communication components, thereby improving heat dissipation during operation.

The claims further detail the materials and configurations of the heat conductive components, emphasizing the importance of thermal conductivity and expansion coefficients. The first heat conductive component is specified to have a thermal conductivity at least 1.5 times higher than that of the second component, and it is designed to be in thermal contact with the housing. Additionally, the substrate may include a metal layer, such as a copper pour, which facilitates thermal contact between the heat conductive components and the optical communication components. The transceiver is identified as a QSFP-DD 800G model, with the optical components being a Transmitter Optical Sub-Assembly (TOSA) and a Receiver Optical Sub-Assembly (ROSA), highlighting its application in high-speed data transmission environments.

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