Camtek. has filed a patent for a semiconductor inspection tool system. The system includes two illumination setups for different purposes and a bonding region sensor unit to collect reflected electromagnetic radiation for analyzing bonding regions in multi-layer stacks. The patent claims more than one rotation cycle for accurate data collection. GlobalData’s report on Camtek gives a 360-degree view of the company including its patenting strategy. Buy the report here.
According to GlobalData’s company profile on Camtek, Pose estimation was a key innovation area identified from patents. Camtek's grant share as of January 2024 was 36%. Grant share is based on the ratio of number of grants to total number of patents.
Semiconductor inspection tool system for multi-layer stack bonding regions

A semiconductor inspection tool system has been patented, comprising a first illumination setup generating radiation directed at bonding regions between layers of a multi-layer stack, a second illumination setup illuminating stack edges, and a sensor unit collecting reflected radiation to generate sensing data indicative of the bonding region. The system includes a processing unit to receive and analyze data from multiple rotation cycles, generating images of layer surfaces and bevels within the stack. The processing unit also controls the positioning and operation of the illumination setups and sensor unit, adjusting exposure rates and other parameters during rotation cycles.
Furthermore, the system includes apex and side sensors to collect reflected radiation from different regions of the stack, with the apex sensor capable of being positioned to focus on specific areas within the stack. An optical element is used to direct reflected radiation towards the sensor unit, and the illumination setups are configured to generate collimated light beams directed at interstitial spaces in the stack. The method for inspection involves generating and directing illumination radiation, collecting reflected radiation, and analyzing data from multiple rotation cycles to generate images of layer surfaces and bevels. The method also includes adjusting exposure rates and other parameters during rotation cycles, focusing on specific regions within the stack, and performing illumination and data collection simultaneously for efficient inspection processes.
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