MACOM Technology Solutions has been granted a patent for a semiconductor device package with multiple input leads, transistor amplifier dies, and a combined output lead to merge output signals. The innovation aims to enhance signal processing efficiency in semiconductor devices. GlobalData’s report on MACOM Technology Solutions gives a 360-degree view of the company including its patenting strategy. Buy the report here.

According to GlobalData’s company profile on MACOM Technology Solutions, Quantum dot devices was a key innovation area identified from patents. MACOM Technology Solutions's grant share as of April 2024 was 70%. Grant share is based on the ratio of number of grants to total number of patents.

Semiconductor device package with combined output lead

Source: United States Patent and Trademark Office (USPTO). Credit: MACOM Technology Solutions Holdings Inc

A recently granted patent (Publication Number: US11967936B2) discloses a semiconductor device package designed to efficiently combine output signals from multiple transistor amplifier dies. The package includes a plurality of input leads connected to transistor amplifier dies, with a combined output lead featuring an edge plane that extends between the outputs of the transistor amplifier dies to output a combined signal. In some embodiments, the package may also include a main amplifier and peaking amplifiers in a Doherty amplifier configuration, along with output prematch circuits for enhanced performance.

Furthermore, the semiconductor device package may incorporate internal and external protrusions in the combined output lead, allowing for efficient signal output. The width of the combined output lead extends from one transistor amplifier die to another within the package, ensuring optimal signal combining. Additionally, the package may feature output leads coupled together by bond wires, along with output prematch circuits for improved signal quality. Overall, the patent highlights innovative design features aimed at enhancing the functionality and performance of semiconductor device packages in amplifier applications.

To know more about GlobalData’s detailed insights on MACOM Technology Solutions, buy the report here.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.