Samsung Electro-Mechanics had three patents in advanced materials during Q1 2024. The patent filed by Samsung Electro-Mechanics Co Ltd in Q1 2024 describes a bulk-acoustic wave (BAW) resonator with a central portion and an extension portion. The extension portion includes an insertion layer and a loss prevention film between the substrate and the second electrode, with the loss prevention film having a thickness of 50 Å to 500 Å. The insertion layer and loss prevention film have opposing side surfaces with different inclination angles, with the second inclination angle being greater than the first inclination angle. GlobalData’s report on Samsung Electro-Mechanics gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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Samsung Electro-Mechanics grant share with advanced materials as a theme is 66% in Q1 2024. Grant share is based on the ratio of number of grants to total number of patents.
Recent Patents
Application: Baw resonator and baw resonator manufacturing method (Patent ID: US20240080011A1)
The patent filed by Samsung Electro-Mechanics Co Ltd describes a bulk-acoustic wave (BAW) resonator with a unique structure that includes a central portion and an extension portion. The extension portion features an insertion layer and a loss prevention film with specific thickness and inclined surfaces. The loss prevention film is crucial for preventing losses in the resonator and is formed with a thickness ranging from 50 Å to 500 Å. Additionally, the insertion layer and loss prevention film are strategically positioned to optimize the resonator's performance, with the second inclination angle of the loss prevention film being greater than the first inclination angle.
The claims associated with the patent detail the specific configurations and materials used in the BAW resonator, such as the use of aluminum nitride (AlN) in the loss prevention film and the arrangement of thin film layers in the resonator structure. The method of manufacturing the BAW resonator involves precise steps like forming, removing, and exposing thin film layers to achieve the desired structure. The method also includes specific etching techniques, such as dry etching for removing the insertion layer and wet etching for removing the loss prevention film. Overall, the patent highlights a novel design and manufacturing process for BAW resonators that aim to improve performance and efficiency in electronic devices.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
