Fujifilm has patented a method for removing ruthenium material from substrates using a polishing composition containing ammonia, oxygenated halogen compound, abrasive, and acid. The composition achieves a high rate of removal for ruthenium compared to other materials, enhancing efficiency in the process. GlobalData’s report on Fujifilm gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Fujifilm, AI-assisted medical imaging was a key innovation area identified from patents. Fujifilm's grant share as of May 2024 was 40%. Grant share is based on the ratio of number of grants to total number of patents.
A recently granted patent (Publication Number: US11999876B2) discloses a method for removing ruthenium material from a substrate, which also contains a second material such as tetraethylorthosilicate (TEOS) or a titanium material. The method involves applying a specific composition to the substrate while polishing it with a polishing pad, resulting in the removal of both the ruthenium material and the second material. The composition includes components like ammonia, an oxygenated halogen compound (e.g., hydrogen periodate), an abrasive (e.g., silica), water, and optionally an acid. The pH of the polishing composition is maintained between 6 and 8, and the method achieves differential removal rates for the ruthenium material and the second material, with the ruthenium material being removed at a faster rate.
Furthermore, the patent claims specify additional details such as the presence of specific acids in the composition, the absence of azoles, and the precise ranges of concentrations for each component. The method outlined in the patent aims to provide an efficient and effective way to remove ruthenium material from substrates, particularly those used in chemical vapor deposition or physical vapor deposition processes. By utilizing a carefully formulated composition and controlling the polishing parameters, the method ensures a high rate of removal for the ruthenium material while minimizing the removal of the second material. This innovation could have significant implications for industries where precise substrate cleaning and material removal are crucial for product quality and performance.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
