Infineon Technologies had nine patents in advanced materials during Q2 2024. Infineon Technologies AG filed a patent for a sensor system that includes a flexible substrate with a metamaterial layer, a transmitter, and a receiver to measure properties based on electromagnetic waves. Another patent describes a substrate arrangement with nanowires evenly distributed on a metallization layer, forming a permanent connection between the layer and a component with fewer nanowires than the total present. GlobalData’s report on Infineon Technologies gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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Infineon Technologies had no grants in advanced materials as a theme in Q2 2024.
Recent Patents
Application: Metamaterial-based deformation sensing system (Patent ID: US20240167815A1)
The patent filed by Infineon Technologies AG describes a sensor system that includes a flexible substrate and a metamaterial layer with conductive elements that change based on the deformation of the substrate. The system uses electromagnetic waves to measure properties affected by the deformation, allowing for the determination of strain resulting from applied forces or environmental conditions. Various configurations and components are detailed, such as transmitters, receivers, processors, and additional metamaterial layers, to enhance the accuracy and versatility of the sensor system.
The sensor system's unique design enables the measurement of strain through the conversion of electromagnetic waves based on the deformation of the flexible substrate. By utilizing strain-dependent couplings and metamaterial layers, the system can accurately detect and analyze changes in properties like phase shift and amplitude shift. The inclusion of multiple layers, antennas, waveguides, and reflective structures further enhances the system's capabilities, allowing for precise strain measurements in various applications and conditions.
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