Kulicke & Soffa Industries has been granted a patent for a method of operating a wire bonding machine. The method involves monitoring and adjusting the bonding force applied during automatic or dry cycle wire bonding operations to ensure accuracy. GlobalData’s report on Kulicke & Soffa Industries gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Kulicke & Soffa Industries, Under-screen biometric identification was a key innovation area identified from patents. Kulicke & Soffa Industries's grant share as of January 2024 was 47%. Grant share is based on the ratio of number of grants to total number of patents.
Monitoring bonding force accuracy in wire bonding machine
A recently granted patent (Publication Number: US11865633B2) discloses a method for operating a wire bonding machine. The method involves incrementally adjusting the bonding force applied to a bond head assembly while monitoring the z-height position of the assembly. By decreasing the bonding force until a predetermined height adjustment is reached and then detecting the bonding force value, the process ensures precise control over the bonding operation. Subsequent steps include increasing the bonding force until the z-height position returns to its initial height, with corresponding force values being recorded at key points in the process, such as when reaching a peak height position. These steps are carried out in a force control mode of operation for optimal performance.
Furthermore, the patent details an alternative method for operating a wire bonding machine, which involves incrementally increasing the bonding force while monitoring the z-height position until a predetermined height adjustment is achieved. Similar to the previous method, the force values are detected at critical points, including when the z-height position returns to its initial height or reaches a peak height position. This method also operates within a force control mode to ensure the accuracy and efficiency of the wire bonding process. By outlining these two distinct methods, the patent provides valuable insights into enhancing the operation of wire bonding machines, particularly in terms of controlling bonding force and z-height position for improved bonding outcomes.
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