National Instruments has patented a method for identifying defects in electronic assemblies using a grid of nodes to determine failed electronic units. By connecting straight lines and analyzing subsets of nodes, the system can efficiently pinpoint faulty components, aiding in the identification and resolution of issues. GlobalData’s report on National Instruments gives a 360-degree view of the company including its patenting strategy. Buy the report here.

According to GlobalData’s company profile on National Instruments, Digital twins was a key innovation area identified from patents. National Instruments's grant share as of January 2024 was 80%. Grant share is based on the ratio of number of grants to total number of patents.

Method to identify defects in electronic assemblies using grid nodes

Source: United States Patent and Trademark Office (USPTO). Credit: National Instruments Corp

A recently granted patent (Publication Number: US11852684B2) discloses a method for identifying defects in an electronic assembly using a grid of nodes to represent the location of electronic units. The method involves determining straight lines based on the grid, matching specific criteria, and identifying failed electronic units by analyzing the intersections of these lines. By utilizing criteria such as the number of nodes in a line and proximity to other nodes, the method can accurately pinpoint failed electronic units within the assembly. Additionally, the patent covers the detection of scratches on the electronic assembly based on the identified lines, enhancing the overall defect identification process.

Furthermore, the patent details variations of the method, including the use of circular lines, relaxed fitting criteria for certain nodes, and the determination of subsets of nodes for more precise defect identification. The method also involves determining proximity sets of nodes to further refine the identification process. By incorporating these elements, the method aims to streamline the defect identification process in electronic assemblies, particularly electronic substrates. The patent also includes instructions for executing the method on a non-transitory storage device, making it accessible for implementation by machines to enhance efficiency and accuracy in identifying defects in electronic assemblies.

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