Siemens and GlobalFoundries (GF) have announced a new partnership to integrate AI-driven technologies into semiconductor manufacturing, targeting increased efficiency and reliability across production processes.
The collaboration, formalised through a memorandum of understanding (MoU), spans areas such as fab automation, electrification, and the deployment of digital solutions throughout the semiconductor lifecycle.
The companies will focus on implementing advanced AI-enabled software, sensors, and real-time control systems within semiconductor fabrication environments.
Through centralised automation and predictive maintenance, Siemens and GF plan to raise equipment availability and streamline chip production workflows.
Both organisations intend to pilot these solutions in their own manufacturing operations with the potential to extend successful approaches into other advanced technology sectors.
According to the parties, this agreement comes as demand surges for semiconductors in critical domains including AI, defence, energy infrastructure, and global connectivity platforms.
By combining expertise, Siemens and GF seek to address industry requirements for secure and reliable supply chains while aiming to enhance industrial resilience through automation.
Siemens brings to the table its suite of technologies for industrial, energy, and building automation, alongside software for chip design, manufacturing process management, fab automation, and product lifecycle management. These capabilities are expected to support seamless integration across multiple stages of semiconductor production and delivery.
Siemens managing board member and digital industries CEO Cedrik Neike said: “Our economy runs on Silicon – one wafer at a time. Chips are critical for applications like robotics or connectivity and for bringing AI into the physical world and industry.
“We are collaborating to make global semiconductor supply chains more resilient and to enable efficient localised manufacturing around the world.”
The Siemens-GF partnership is structured to allow both companies to leverage these tools in developing and manufacturing high-performance chips at scale.
GF contributes specialised process technology and design expertise through its foundry operations as well as through MIPS, its subsidiary focused on RISC-V processor IP.
Together with Siemens’ technologies, this expertise will be applied to accelerate development cycles for custom semiconductor solutions tailored to applications such as autonomous systems and AI hardware platforms.
GF’s operational footprint includes manufacturing facilities across the US, Asia, and Europe. Its Dresden site remains the largest semiconductor production facility in Europe with approximately 3,000 employees.
GF CEO Tim Breen said: “Secure, locally manufactured semiconductors are at the core of the AI transition – from cloud to the physical world, bringing intelligence into devices we use every day and enabling applications we couldn’t imagine a few years ago.
“Our unique collaboration with Siemens allows us to go faster – to build the technologies that make this possible – differentiated, energy-efficient, connected and secure chips across a wide range of next-generation applications.”
In November 2025, GF entered into a separate long-term partnership with Navitas Semiconductor aimed at advancing gallium nitride (GaN) technology in the US.
The agreement covers the co-development and delivery of solutions for high-power applications including datacentres, high-performance computing infrastructure, grid systems, and industrial electrification initiatives. The move is designed to reinforce domestic GaN supply chains while supporting decarbonisation objectives in emerging energy and compute markets.
