Onto Innovation. has filed a patent for a metrology apparatus that uses light to measure substrate and film thicknesses. The apparatus includes an illumination source, polarizer, optical detector, and analyzer to determine the thickness of substrates with optical anisotropies. GlobalData’s report on Onto Innovation gives a 360-degree view of the company including its patenting strategy. Buy the report here.

According to GlobalData’s company profile on Onto Innovation, Defect detection models was a key innovation area identified from patents. Onto Innovation's grant share as of January 2024 was 62%. Grant share is based on the ratio of number of grants to total number of patents.

Metrology apparatus for measuring substrate and film thicknesses

Source: United States Patent and Trademark Office (USPTO). Credit: Onto Innovation Inc

A metrology apparatus for measuring the thickness of a substrate has been described in a filed patent (Publication Number: US20240027186A1). The apparatus includes an illumination source, a polarizer, an optical detector, and an analyzer to determine the angle in the plane of polarization to which the light received from the substrate has been rotated due to optical properties. Additional components such as a compensator and optical compensator are included to enhance the accuracy of the measurements. The method for measuring the thickness involves setting the polarization state of the light source, selecting wavelengths, impinging a beam of light onto the substrate, and calculating the thickness based on the returned light signal. The apparatus is designed to handle substrates with chiral properties and includes features like a collimator and objective lens for efficient measurement.

Furthermore, the metrology apparatus includes features like a photodetector or spectrometer as the optical detector, and the illumination source can be modified to match the eigenmode of silicon. The method involves converting received readings to digital signals, preparing a Fourier transform, and determining peak amplitudes for accurate measurements. The apparatus is specifically designed to handle substrates with chiral properties, with components like a polarizer and analyzer located in a common optical path. The inclusion of an optical compensator helps in determining the optical path difference between the illumination source and the received light, ensuring precise measurements of substrate thickness and films formed on the substrate.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.