Powertech Technology has been granted a patent for a package structure that includes multiple components like dies, encapsulant, dam structure, light-transmitting sheet, conductive connector, circuit layer, and conductive terminal. The structure allows for efficient electrical connection between the dies through innovative design elements. GlobalData’s report on Powertech Technology gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Powertech Technology, Under-screen biometric identification was a key innovation area identified from patents. Powertech Technology's grant share as of May 2024 was 56%. Grant share is based on the ratio of number of grants to total number of patents.
Package structure with first and second die connected electrically
A recently granted patent (Publication Number: US11990494B2) discloses a package structure comprising a first die with a silicon substrate and die pad, a second die arranged to face the first die, an encapsulant covering the second die, a dam structure exposing the sensing area of the first die, a light-transmitting sheet, conductive connectors, circuit layers, insulating layers, and a conductive terminal. The package structure enables electrical connection between the first and second dies through various components like through silicon vias, dielectric layers, and gas gaps, providing a comprehensive and efficient packaging solution for electronic devices.
Furthermore, the patent claims variations in the package structure, such as the positioning of the die connector on the second die, the location of the second circuit layer between the first and second dies, and the management of air pressure within the enclosed space formed by the first die, dam structure, and light-transmitting sheet. These variations aim to optimize the performance and functionality of the package structure, ensuring reliable operation and protection of the electronic components within. Overall, the patent highlights a sophisticated packaging design that addresses the challenges of interconnecting multiple dies in a compact and efficient manner, catering to the evolving needs of the electronics industry.
To know more about GlobalData’s detailed insights on Powertech Technology, buy the report here.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
