Powertech Technology‘s patent involves a packaging structure with multiple dies, an encapsulant, circuit structure, and filler. The design allows for optical signal transmission and efficient electrical connections. The method of manufacturing this packaging structure is also detailed. GlobalData’s report on Powertech Technology gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Powertech Technology, Under-screen biometric identification was a key innovation area identified from patents. Powertech Technology's grant share as of February 2024 was 79%. Grant share is based on the ratio of number of grants to total number of patents.
Packaging structure with multiple dies and optical signal transmission
A recently granted patent (Publication Number: US11916035B2) discloses a packaging structure for electronic devices, comprising multiple dies interconnected through a redistribution circuit structure. The structure includes a filler positioned between the dies and the redistribution circuit structure, with a groove on the upper surface of the redistribution circuit structure separating the filler into distinct areas. The third die in the structure features an optical signal transmission area that does not overlap with the filler, redistribution circuit structure, or encapsulant in a direction perpendicular to the encapsulant surface. The innovative design aims to enhance the efficiency and functionality of electronic packaging, particularly in applications requiring optical signal transmission.
Moreover, the patent also details a manufacturing method for the packaging structure, involving the formation of the redistribution circuit structure on a preliminary structure. This process includes creating a top insulating material layer and removing part of it to form the groove. Additional steps involve forming the insulating layer with an insulating opening, filling the top insulating material layer into the opening, and cutting the structure into multiple preliminary structures after forming the groove. The method aims to streamline the production of the packaging structure, ensuring efficient and precise assembly of the electronic components. Overall, the patent highlights advancements in packaging technology that can potentially revolutionize the design and manufacturing processes in the electronics industry.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
