Screen has patented a substrate processing apparatus for removing resist from a substrate using a liquid mixture of sulfuric acid and hydrogen peroxide water. The apparatus includes a unique sulfuric acid-containing liquid supply device and nozzle for efficient processing. GlobalData’s report on Screen gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Screen, Semiconductor fabrication robots was a key innovation area identified from patents. Screen's grant share as of January 2024 was 37%. Grant share is based on the ratio of number of grants to total number of patents.
Substrate processing apparatus for removing resist from substrate
A recently granted patent (Publication Number: US11883858B2) discloses a substrate processing apparatus designed for removing a resist from a substrate using a liquid mixture of sulfuric acid and hydrogen peroxide water, known as SPM. The apparatus includes a substrate holding unit, a nozzle for spouting the SPM towards the substrate, a mixing portion, a sulfuric acid-containing liquid supply device, and a hydrogen peroxide water supply unit. The sulfuric acid-containing liquid supply device consists of a first liquid storage with a tank for recovered liquid and a sulfuric acid adding unit, and a second liquid storage with a tank for liquid supplied from the first tank, a circulation pipe, and a heater for heating the liquid. Additionally, the apparatus features elements such as a sulfuric acid concentration meter, a mixing ratio changing unit, and a recovery system for the expelled liquid.
Furthermore, the substrate processing apparatus includes various components like a guard switching unit for managing liquid flow, multiple heaters for maintaining specific temperatures, and a filter for capturing foreign matter in the sulfuric acid-containing liquid. The patent also describes the use of a cooler for cooling the liquid and the implementation of natural cooling for specific components. With a focus on efficient resist removal from substrates, the apparatus offers a comprehensive solution for utilizing SPM effectively in the semiconductor manufacturing process. The detailed design and functionality of the apparatus as outlined in the patent claims highlight the innovation and technical advancements in substrate processing technology.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
