Seagate Technology has filed a patent for a method of forming a recording head with an integrated laser diode. The method involves forming a waveguide, heat sink, and bleed resistor on a substrate, planarizing the heat sink, and transfer printing a laser diode onto the planarized heat sink. GlobalData’s report on Seagate Technology gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Seagate Technology, artificial concrete aggregates was a key innovation area identified from patents. Seagate Technology's grant share as of September 2023 was 71%. Grant share is based on the ratio of number of grants to total number of patents.
Method for forming an integrated laser diode on a heat sink
A recently filed patent (Publication Number: US20230318257A1) describes a method and apparatus for forming an integrated laser diode on a recording head. The method involves several steps, including forming a recording head with a waveguide on a first substrate, forming a heat sink on the first substrate, and forming a bleed resistor that is coupled to the heat sink and the substrate. The top surface of the heat sink is then planarized, and a laser diode formed on a second substrate is transfer printed onto the planarized heat sink to create an integrated laser diode.
The patent claims also specify additional details about the method and apparatus. For example, the planarization of the heat sink is done in a way that aligns the integrated laser diode with the waveguide. The alignment is within a range of about 50 nm to about 150 nm in the z-direction. The planarized heat sink has a surface roughness of less than about 0.5 nm root mean squared, which ensures a smooth and uniform surface.
Various techniques can be used for planarizing the top surface of the heat sink, including mechanical polishing, chemical polishing, or chemical mechanical polishing. Additionally, a bleed resistor is configured to prevent electrostatic discharge (ESD) damage to the laser diode during and after the transfer printing process. The resistance of the bleed resistor is between about 5 and about 10 kilo-Ohms.
The apparatus described in the patent includes a recording head with a waveguide, a heat sink, a bleed resistor, and a laser diode. The top surface of the heat sink is planarized to align the integrated laser diode with the waveguide. The planarized heat sink has a surface roughness of less than about 0.5 nm root mean squared. The bleed resistor is designed to prevent ESD damage to the laser diode during and after transfer printing, and its resistance is between about 5 and about 10 kilo-Ohms.
The heat sink in the apparatus can be made of various materials, including Cu, AlN, Au, NiFe, NiCr, Al2O3, CuW, or combinations thereof. The first substrate, on which the recording head, heat sink, and bleed resistor are disposed, is electrically grounded to ensure proper functioning of the integrated laser diode.
Overall, this patent presents a method and apparatus for integrating a laser diode onto a recording head, providing improved alignment and protection against ESD damage. The described techniques and configurations can enhance the performance and reliability of laser diodes used in various applications.
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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
