STMicroelectronics had 19 patents in advanced materials during Q2 2024. STMicroelectronics NV filed patents for transducer assemblies with buried cavities and piezoelectric actuators, MEMS devices with coupling pillars and stiffening structures, microelectromechanical resonator devices with piezoelectric resonator structures, quantum dot-based pixel devices for event-based and light intensity imaging, and an integrated electronic system with a monitoring system for detecting defects using acoustic waves. GlobalData’s report on STMicroelectronics gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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STMicroelectronics had no grants in advanced materials as a theme in Q2 2024.
Recent Patents
Application: Transducer assembly with buried cavities and method of manufacturing the same (Patent ID: US20240205611A1)
The patent filed by STMicroelectronics NV describes a transducer assembly with buried cavities in a substrate that form membranes, on which piezoelectric actuators are placed to drive the membranes at a specific frequency. The anchoring of the membranes to the substrate is designed to prevent unwanted flexure modes within the operating bandwidth of the transducer assembly. The device includes piezoelectric actuators, cavities, electrical pathways, and contacts to facilitate the operation of the transducer assembly.
The device also incorporates an ASIC assembly with second contacts and solder structures to connect to the first contacts on the substrate. The dimensions of the cavities and actuators are specified to ensure proper alignment and functionality. The method outlined in the patent involves forming the transducer assembly, including the cavities, electrical pathways, and piezoelectric actuators, and coupling an ASIC assembly to control the actuators. The fabrication process includes etching the substrate, growing epitaxial material, and forming conductive layers to establish the necessary components for the transducer assembly.
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