India’s Tata Consultancy Services (TCS) has launched its Chiplet-based System Engineering Services to enable semiconductor companies design faster and more powerful chips.
The company will use chiplets- small integrated circuits which serve as the foundational building blocks for larger chips- to enable the development of faster and more efficient processors.
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TCS Software and Services Technology president V Rajanna said: “Semiconductors are the foundational technology driving digital innovation and powering differentiated experiences. TCS Chiplet-based System Engineering services will help semiconductor enterprises accelerate chiplets tapeout driving flexibility, scalability and faster time to market.
“Our extensive investments in next-gen technologies, contextual knowledge of the semiconductor industry, and strong track record in execution make us the preferred partner to drive innovation at scale.”
The service aims to tap India’s semiconductor market, which is expected to grow from an estimated $45–50bn in 2024-2025 to $100–110bn by 2030.
According to TCS, the semiconductor sector is undergoing a transformation where traditional methods of shrinking transistors on larger chips are becoming inadequate. The industry is shifting towards chiplet-based design, which enables combining multiple smaller chips tailored for specific needs.
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By GlobalDataThis approach helps overcome scaling limitations, accelerates product launches, and reduces costs, as AI, cloud computing, smartphones, electric vehicles, and connected devices drive chip demand.
In a recent collaboration, TCS worked with an unnamed North American semiconductor company to streamline the integration of different chip types into a single system.
Under Chiplet-based System Engineering Services, TCS is offering a comprehensive suite of design and verification services, including UCIe (Universal Chiplet Interconnect Express) and HBM (High Bandwidth Memory).
The company also provides advanced package design services, such as 2.5D and 3D interposers and multi-layer organic substrates, crucial for connecting and supporting multi-chip packages.
Earlier in 2025, TCS teamed up with Salesforce to improve AI solutions for the manufacturing and semiconductor industries.
