Zhen Ding Technology has been granted a patent for a method of manufacturing a base plate and a circuit board design. The innovative process involves creating connecting portions and pins to enhance circuit board functionality. GlobalData’s report on Zhen Ding Technology gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Zhen Ding Technology, Under-screen biometric identification was a key innovation area identified from patents. Zhen Ding Technology's grant share as of May 2024 was 48%. Grant share is based on the ratio of number of grants to total number of patents.
Circuit board with multiple connecting pins and layers
A recently granted patent (Publication Number: US12004294B2) discloses a circuit board design comprising multiple layers arranged in a specific order. The inner line layer includes a copper layer and an electroplated layer, with connecting portions and pins strategically placed to facilitate connections between different layers. The design also incorporates holes and connecting pins to enhance the functionality and connectivity of the circuit board.
Furthermore, the patent details various configurations and materials used in the circuit board, such as the shape of holes, dimensions of connecting pins, and the composition of the base layer. The design aims to optimize the performance and durability of the circuit board while ensuring efficient connections between components. The patent highlights the importance of specific dimensions and materials in achieving the desired results, showcasing a novel approach to circuit board design in the field of electronics.
To know more about GlobalData’s detailed insights on Zhen Ding Technology, buy the report here.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
