Will Semiconductor has filed a patent for an image sensor and fabrication method. The sensor includes a semiconductor substrate with pixel regions, adhesive frames with biological liquid crystals, and a glass coverplate. The bonding layer loses bonding power when exposed to heat or UV light. GlobalData’s report on Will Semiconductor gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Will Semiconductor, Under-screen biometric identification was a key innovation area identified from patents. Will Semiconductor's grant share as of January 2024 was 72%. Grant share is based on the ratio of number of grants to total number of patents.
Image sensor with biological liquid crystal sensing interface
The patent application (Publication Number: US20240038812A1) describes an innovative image sensor design that incorporates a biological liquid crystal sensing interface. The image sensor includes a semiconductor substrate with pixel regions, an adhesive frame with reaction well adhesive frames filled with a biological liquid crystal, and a glass coverplate. A unique bonding layer is used to attach the adhesive frame to the glass coverplate, which loses bonding power when exposed to heat or ultraviolet light. The biological liquid crystal can have antigen-modified or antibody-modified sensing interfaces, enhancing the sensor's capabilities.
Furthermore, the patent application details the specific configurations of the reaction well adhesive frames, including circular ring and polygonal ring shapes, as well as the size range of the biological liquid crystal within them. The sensor also features additional components such as microlens arrays, color filter units, and polarizer layers to optimize image quality. The fabrication method outlined in the patent involves forming the adhesive frame on the semiconductor substrate, filling the reaction well adhesive frames with the biological liquid crystal, and bonding the glass coverplate using the unique bonding layer. The method allows for precise control over the sensor's construction and functionality, ensuring high performance and reliability.
To know more about GlobalData’s detailed insights on Will Semiconductor, buy the report here.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
