Microchip Technology has patented a method for forming flat no-leads IC packages with solder wettable leadframe terminals. The process involves laser grooving, saw step cutting, plating, and singulation to enhance soldering. This innovation improves package reliability and manufacturing efficiency. GlobalData’s report on Microchip Technology gives a 360-degree view of the company including its patenting strategy. Buy the report here.
Smarter leaders trust GlobalData
Access deeper industry intelligence
Experience unmatched clarity with a single platform that combines unique data, AI, and human expertise.
According to GlobalData’s company profile on Microchip Technology, Adaptive video coding was a key innovation area identified from patents. Microchip Technology's grant share as of January 2024 was 59%. Grant share is based on the ratio of number of grants to total number of patents.
Flat no-leads ic packages with solder wettable leadframe terminals
A recently granted patent (Publication Number: US11887864B2) discloses a method for forming an electronic device involving the encapsulation of an integrated circuit (IC) structure mounted on a leadframe. The method includes steps such as performing a laser grooving process to remove mold compound, saw step cutting to define IC packages, plating exposed surfaces with solder-enhancing material, and a singulation process to separate the IC packages. The innovative technique ensures enhanced solder connections between the IC packages and a printed circuit board (PCB) by utilizing specific plating materials and precise cutting processes.
Furthermore, the patent details additional steps such as a deflash process to chemically remove excess mold compound, half etching a leadframe blank before mounting the dies, and specific dimensions for the saw step cut groove. The method aims to optimize the manufacturing process of electronic devices by improving the quality and reliability of solder connections between IC packages and PCBs. The use of laser grooving, saw step cutting, and plating processes ensures the efficient production of electronic devices with enhanced performance and durability, meeting the demands of modern technology and consumer electronics markets.
To know more about GlobalData’s detailed insights on Microchip Technology, buy the report here.
Data Insights
From
The gold standard of business intelligence.
Blending expert knowledge with cutting-edge technology, GlobalData’s unrivalled proprietary data will enable you to decode what’s happening in your market. You can make better informed decisions and gain a future-proof advantage over your competitors.
GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
