Corning had 12 patents in advanced materials during Q2 2024. Corning Inc has developed articles and methods for temporary bonding of substrates, utilizing a photo-release layer that can be reversed upon exposure to light. Plasma treatment of the photo-release layer increases bonding energy, enabling processing with greater mechanical force before separation. This method allows for temporary bonding with a thinner photo-release layer and low total thickness variation, facilitating bonding of processed substrates to other substrates. GlobalData’s report on Corning gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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Corning had no grants in advanced materials as a theme in Q2 2024.
Recent Patents
Application: Article and method for temporary bonding of substrates (Patent ID: US20240208198A1)
The patent filed by Corning Inc. describes articles and methods for temporary bonding of substrates using a photo-release layer that can be reversed upon exposure to light. The bonding structure includes a photo-release layer with an average thickness less than 10.0 microns and a bonding energy greater than 200 mJ/m2, achieved through plasma treatment to increase bonding energy and enable processing with greater mechanical force before separation. The method allows for temporary bonding with a thinner photo-release layer and low total thickness variation (TTV), facilitating subsequent bonding of processed substrates to other substrates.
The article claims detail the composition and characteristics of the substrates, bonding structure, and photo-release layer, emphasizing the importance of specific thickness, total thickness variation, and extinction coefficient for effective temporary bonding. The method claims outline the steps involved in treating the photo-release layer with plasma, bonding substrates with sufficient bonding energy, processing the substrates, and debonding the processed substrate for further applications. Overall, the patent focuses on innovative techniques for temporary bonding that enable efficient processing and subsequent bonding of substrates in various applications.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
