Oki Electric Industry had one patents in advanced materials during Q2 2024. The manufacturing method involves transferring a functional layer from one substrate to another by using a support layer and a thin film holding layer. The support layer extends from the functional layer to the original substrate, providing support during the transfer process. The thin film holding layer is used to facilitate the transfer of the functional layer to the new substrate. GlobalData’s report on Oki Electric Industry gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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Oki Electric Industry had no grants in advanced materials as a theme in Q2 2024.
Recent Patents
Application: Manufacturing method of electronic device (Patent ID: US20240145620A1)
The patent filed by Oki Electric Industry Co Ltd. describes a manufacturing method for electronic devices involving the formation of a support layer extending from a functional layer on a first substrate to support the functional layer, followed by the addition of a thin film holding layer, removal of the first layer, transfer of the functional layer, support layer, and thin film holding layer to a different substrate, and removal of the thin film holding layer. The method aims to efficiently transfer functional layers between substrates while maintaining structural integrity.
The claims associated with the patent detail specific aspects of the manufacturing method, such as the thickness and shear strength of the thin film holding layer, the configuration of the support layer, and the use of a transfer member with concaves and convexes for joining layers. Additionally, the claims specify variations in the formation and removal of layers based on the type of electronic device being manufactured, including piezoelectric and photoelectric conversion devices. Overall, the patent outlines a comprehensive process for transferring functional layers in electronic devices with precision and reliability, offering potential advancements in manufacturing technology for various applications.
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