Soitec has been granted a patent for substrates for microelectronic radiofrequency devices. The invention involves a semiconductor substrate with trenches filled with a high-resistivity material and a piezoelectric material. The method includes forming trenches, filling them, and placing the piezoelectric material on the substrate. GlobalData’s report on Soitec gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Soitec, 3D memory devices was a key innovation area identified from patents. Soitec's grant share as of February 2024 was 52%. Grant share is based on the ratio of number of grants to total number of patents.
Substrate for microelectronic radiofrequency devices with resistive trenches
A recently granted patent (Publication Number: US11923239B2) discloses a novel substrate design for microelectronic radiofrequency devices. The substrate comprises a support substrate with a first semiconductor material and a plurality of trenches filled with a second material, isolating multiple first zones on one side and at least one second zone. A useful layer made of semiconductor, conductive, or piezoelectric material is located above the support substrate, with an insulating layer directly between them. The second material can be silicon oxide, silicon nitride, silicon oxynitride, or aluminum nitride, with the trenches having a depth between 1 to 100 microns.
Furthermore, the patent includes a method for manufacturing the substrate, involving forming trenches in a semiconductor substrate, filling them with a filler material, and placing a dielectric layer on the substrate's surface. The average thermal conductivity of the substrate is at least 20 W/m·K, ensuring efficient heat dissipation. The method also involves placing a useful layer, which can be semiconductor, insulating, conductive, or piezoelectric material, on or above the dielectric layer. This innovative design aims to enhance the performance of microelectronic radiofrequency devices by providing a substrate with improved thermal conductivity and material composition, ultimately contributing to the advancement of the field.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
