IBIDEN has been granted a patent for a wiring substrate with improved adhesion between conductor layers. The substrate includes connection conductors, pads, and wiring patterns with specific surface roughness for enhanced performance. GlobalData’s report on IBIDEN gives a 360-degree view of the company including its patenting strategy. Buy the report here.
Smarter leaders trust GlobalData
Access deeper industry intelligence
Experience unmatched clarity with a single platform that combines unique data, AI, and human expertise.
According to GlobalData’s company profile on IBIDEN, Diesel Particulate Filters (DPF) was a key innovation area identified from patents. IBIDEN's grant share as of May 2024 was 37%. Grant share is based on the ratio of number of grants to total number of patents.
Wiring substrate with improved adhesion between conductor layers
A recently granted patent (Publication Number: US11996357B2) discloses a novel wiring substrate design that aims to enhance adhesion between conductor layers and insulating layers. The wiring substrate comprises a first conductor layer with conductor pads and wiring patterns, an insulating layer covering the first conductor layer, a second conductor layer, and connection conductors penetrating through the insulating layer to connect the conductor layers. A key feature of the design is the inclusion of a coating film on the conductor layer's surface to improve adhesion, particularly on roughened surfaces of the conductor pads. The roughening process is crucial, with the conductor pads having a higher surface roughness than the wiring patterns, ensuring optimal adhesion properties.
Moreover, the patent also details a method for manufacturing the wiring substrate, involving steps such as roughening the exposed surface of the first conductor layer, forming a coating film, and creating the insulating layer and connection conductors. Notably, the method includes specific actions like removing the coating film covering the conductor pads before insulating layer formation and reducing the surface roughness of certain conductor pad surfaces connected to the connection conductors. By following this method, the resulting wiring substrate can exhibit improved adhesion properties and overall performance, making it a promising innovation in the field of electronic components manufacturing.
To know more about GlobalData’s detailed insights on IBIDEN, buy the report here.
Data Insights
From
The gold standard of business intelligence.
Blending expert knowledge with cutting-edge technology, GlobalData’s unrivalled proprietary data will enable you to decode what’s happening in your market. You can make better informed decisions and gain a future-proof advantage over your competitors.
GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
