Hon Hai Precision Industry had one patents in 3D printing during Q2 2024. The patent filed by Hon Hai Precision Industry Co Ltd in Q2 2024 describes a core wire with an inner conductor and an insulating layer made using a 3D printing process. The insulating layer consists of two semi-insulating layers with grooves matching the shape of the inner conductor, which are combined together. GlobalData’s report on Hon Hai Precision Industry gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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Hon Hai Precision Industry had no grants in 3D printing as a theme in Q2 2024.
Recent Patents
Application: Core wire and method of making same and cable including the core wire (Patent ID: US20240177887A1)
The patent filed by Hon Hai Precision Industry Co Ltd describes a core wire for cables that includes an inner conductor and an insulating layer made through a 3D printing process. The insulating layer consists of two semi-insulating layers with grooves that match the shape of the inner conductor, which are then combined. The method of making the core wire involves 3D printing the semi-insulating layers with grooves and then receiving the inner conductor in these grooves before combining the layers to form the core wire.
Additionally, the patent claims specify details such as the bonding methods for the semi-insulating layers, the air content within the insulating layer, the materials for the inner conductor and insulating layer, and the formation of the inner conductor by twisting multiple conductors. The patent also extends to a cable comprising the described core wire, emphasizing the specific arrangement of core wires within the cable to ensure optimal performance. Overall, the innovation lies in the use of 3D printing to create a specialized insulating layer for core wires, enhancing the efficiency and functionality of cables in various applications.
To know more about GlobalData’s detailed insights on Hon Hai Precision Industry, buy the report here.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
