Advantest had 28 patents in future of work during Q4 2023. Advantest Corp’s Q4 2023 patents focus on improving thermal performance and efficiency in testing apparatus. The inventions include a gimbaling socket structure for secure contact between a device under test (DUT) and a thermal array, a testing apparatus with dedicated slots for test interface boards, a heater drive controlling apparatus for electronic component testing, a control device for regulating signal based on DUT contacting structure temperature, and a power supply unit with multiple channels for improved voltage regulation. These innovations aim to enhance testing capabilities, reduce costs, and increase cooling capacity for high-powered devices. GlobalData’s report on Advantest gives a 360-degreee view of the company including its patenting strategy. Buy the report here.
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Advantest grant share with future of work as a theme is 50% in Q4 2023. Grant share is based on the ratio of number of grants to total number of patents.
Recent Patents
Application: Tension-based socket gimbal for engaging device under test with thermal array (Patent ID: US20230393188A1)
The patent filed by Advantest Corp. describes a gimbaling socket structure that uses tension to bring a device under test (DUT) into secure contact with a liquid-cooled thermal array during testing. This structure allows for even, level, and secure contact between the DUT and the thermal array, improving thermal performance by reducing air gaps and variations in cooling efficiency. The system enables testing of multiple DUTs in parallel within a small space, reducing overall costs and providing greater cooling capacity for high-powered devices.
The test system consists of a socket structure coupled to a spring under tension, supported by a baseplate, and a thermal array with arms that lift the socket structure to bring the DUT into contact with the thermal array for cooling. The socket structure includes a socket and a socket interface board, while the baseplate features support pillars. Thermal interface material (TIM) ensures secure contact between the DUT and thermal array, with the gimbaling socket structure allowing for movement in multiple directions. The spring applies tension equivalent to 1 to 3 pounds, bringing the socket structure back to the rest position when released by the arms. Multiple socket structures, each with its spring and corresponding thermal array, can be used to test multiple DUTs simultaneously, with the system accommodating a liquid-cooled cold plate for enhanced cooling efficiency.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
