Amkor Technology has filed a patent for a fingerprint sensor device and a method of making it. The device includes an interconnection structure, such as a bond wire, that extends into a dielectric layer used to mount a plate. Additionally, the device has an interconnection structure that extends upward from the semiconductor die at a location offset from the plate. The patent claims have been canceled. GlobalData’s report on Amkor Technology gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Amkor Technology, under-screen biometric identification was a key innovation area identified from patents. Amkor Technology's grant share as of September 2023 was 58%. Grant share is based on the ratio of number of grants to total number of patents.
Fingerprint sensor device with extended bond wire
A recently filed patent (Publication Number: US20230290699A1) describes a sensor device with improved design and functionality. The device includes a substrate with a conductive layer, an electronic component with a sensing area, and a conductive interconnection structure that connects the electronic component to the substrate. The device also features an encapsulating material that surrounds the electronic component and a plate positioned over the sensing area.
In one embodiment, the electronic component includes a conductive pad on the top side, and the plate is positioned over this pad. This configuration allows for efficient and accurate sensing capabilities. The electronic component can also be a semiconductor die, providing enhanced performance and reliability.
The bottom side of the electronic component is directly coupled to the top side of the substrate, ensuring a secure and stable connection. The plate is positioned directly above the conductive interconnection structure, maximizing the efficiency of the device. The encapsulating material surrounds the conductive interconnection structure entirely and directly contacts it, further enhancing the device's performance.
The top side of the encapsulating material is vertically higher than the uppermost part of the conductive interconnection structure, while the bottom side is vertically lower than the lowermost part. This arrangement ensures proper alignment and functionality of the device.
The device also includes a dielectric layer that is coupled to the encapsulating material. This layer covers the top side of the encapsulating material entirely, providing additional protection and insulation. The lateral sides of the substrate, encapsulating material, plate, and dielectric layer are coplanar, ensuring a compact and streamlined design.
The manufacturing method for this sensor device involves positioning the plate over the sensing area of the electronic component and providing the encapsulating material around it. The method also includes coupling a dielectric layer to the encapsulating material or the top side of the electronic component, depending on the embodiment.
Overall, this patent describes a sensor device with improved design and functionality, offering enhanced sensing capabilities and reliability. The device's compact and streamlined design, along with its secure connections and protective layers, make it suitable for various applications in industries such as automotive, consumer electronics, and healthcare.
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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
