Amkor Technology. has been granted a patent for a method of manufacturing a packaged electronic device structure. This method involves a conductive leadframe, an electronic device, and an embedded antenna structure designed to resonate with electrical signals, enhancing the device’s functionality. GlobalData’s report on Amkor Technology gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Amkor Technology, Under-screen biometric identification was a key innovation area identified from patents. Amkor Technology's grant share as of July 2024 was 75%. Grant share is based on the ratio of number of grants to total number of patents.
Method for manufacturing packaged electronic devices with embedded antennas
The patent US12062833B2 outlines a method for manufacturing a packaged electronic device structure that integrates an antenna within the device's packaging. The process begins with the provision of a first die pad, conductive leads, and an electronic device that is electrically connected to these leads. The device is then encapsulated within a package body, which also contains portions of the conductive leads and the first die pad. A key feature of this method is the inclusion of an antenna structure that is at least partially embedded within the package body. This antenna structure is designed to resonate in response to electrical signals and includes a slot positioned within the first die pad, strategically located between the electronic device and the edge of the pad.
Further claims detail variations in the antenna structure, including configurations where the slot may completely or partially surround the first die pad. The method also describes the construction of the first die pad with varying thicknesses and the attachment of the electronic device to a thicker portion. Additional claims elaborate on the manufacturing of an antenna structure using an insulative substrate with embedded conductive traces and a ground plane, along with a conductive feed structure. The patent also covers the integration of multiple electronic components, including a second electronic component with an antenna, and the potential use of a balun device to facilitate electrical coupling between components. Overall, the patent presents a comprehensive approach to creating compact electronic devices with integrated antenna capabilities, enhancing their functionality in communication applications.
To know more about GlobalData’s detailed insights on Amkor Technology, buy the report here.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
