Amkor Technology. has been granted a patent for a semiconductor device featuring a substrate with a transceiver pattern and an integrated antenna structure. The design includes a cavity beneath the antenna element, enhancing its functionality while allowing for the coupling of an electronic component to the substrate’s bottom side. GlobalData’s report on Amkor Technology gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Amkor Technology, Under-screen biometric identification was a key innovation area identified from patents. Amkor Technology's grant share as of June 2024 was 75%. Grant share is based on the ratio of number of grants to total number of patents.
Semiconductor device with integrated antenna and transceiver structure
The granted patent US12046798B2 describes an electronic device featuring a substrate with a top and bottom side, which incorporates a first dielectric structure and a first conductive structure. The first conductive structure includes a transceiver pattern located near the substrate's top side. An antenna structure is integrated into the device, consisting of a second dielectric structure attached to the substrate's top side and a second conductive structure that includes a first antenna element. This first antenna element is characterized by a uniform width in cross-section and is positioned over the transceiver pattern, with a cavity located beneath it. The design ensures that the first antenna element is securely fixed to the second dielectric structure, which also houses an electronic component connected to the substrate's bottom side.
Further claims detail additional features of the electronic device, such as the inclusion of a conductor linking the first antenna element to the substrate, and various configurations of the second dielectric structure, which may be molded or segmented. The patent also describes a second antenna element, which is separated from the first by a cavity, and the potential for vents within the dielectric structures. The device's design emphasizes the integration of multiple components while maintaining structural integrity, with encapsulants covering certain areas to protect the electronic components. Overall, the patent outlines a sophisticated arrangement of dielectric and conductive structures aimed at enhancing the functionality of electronic devices.
To know more about GlobalData’s detailed insights on Amkor Technology, buy the report here.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
