Amkor Technology’s patent involves an electronic device with a unique substrate design, conductive structure, and encapsulation method. The semiconductor device features lead protrusions and traces, encapsulated to optimize electrical signal routing and component protection. The innovation enhances electronic component integration and performance. GlobalData’s report on Amkor Technology gives a 360-degree view of the company including its patenting strategy. Buy the report here.
Smarter leaders trust GlobalData
Access deeper industry intelligence
Experience unmatched clarity with a single platform that combines unique data, AI, and human expertise.
According to GlobalData’s company profile on Amkor Technology, Under-screen biometric identification was a key innovation area identified from patents. Amkor Technology's grant share as of January 2024 was 58%. Grant share is based on the ratio of number of grants to total number of patents.
Semiconductor device with lead structure and encapsulation
A recently granted patent (Publication Number: US11887916B2) discloses a semiconductor device featuring a unique design for improved functionality. The device includes a substrate with a conductive structure comprising a lead via, lead protrusion, and lead trace, all encapsulated by a substrate encapsulant. The lead protrusion and lead trace extend from the substrate encapsulant at the second side of the substrate, with the lead trace laterally routing electrical signals. Additionally, a semiconductor component is electrically coupled to the conductive structure, encapsulated by a body encapsulant, and overlies the lead via in a flip-chip configuration. The device's design allows for efficient signal routing and component integration, enhancing overall performance.
Furthermore, the patent details various configurations and features of the semiconductor device, such as different electrical signal paths (fan-in or fan-out), terminal layers, and lateral separations between components. The lead trace's ability to route signals within or outside the footprint of the semiconductor component provides flexibility in design and functionality. Additionally, the inclusion of a redistribution structure coupled to the lead via further expands the routing capabilities of the device, allowing for various fan-in and fan-out paths. Overall, the patented semiconductor device showcases innovative design elements aimed at optimizing signal transmission and component integration in a compact and efficient manner, catering to the evolving needs of the semiconductor industry.
To know more about GlobalData’s detailed insights on Amkor Technology, buy the report here.
Data Insights
From
The gold standard of business intelligence.
Blending expert knowledge with cutting-edge technology, GlobalData’s unrivalled proprietary data will enable you to decode what’s happening in your market. You can make better informed decisions and gain a future-proof advantage over your competitors.
GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
