Applied Optoelectronics. has been granted a patent for an optical transceiver housing featuring an integrated vapor chamber. This design enhances heat transfer by exposing the heat output side to the exterior, while the heat input side includes multiple regions tailored to various internal heat-generating components. GlobalData’s report on Applied Optoelectronics gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Applied Optoelectronics, Quantum key distribution was a key innovation area identified from patents. Applied Optoelectronics's grant share as of July 2024 was 63%. Grant share is based on the ratio of number of grants to total number of patents.
Optical transceiver housing with integrated vapor chamber
The granted patent US12055775B2 describes a transceiver housing designed to enhance thermal management through the integration of a vapor chamber. The housing consists of two portions extending along a major axis, forming a compartment with inner surfaces. The vapor chamber, embedded within one of the housing portions, features a heat input side that is thermally coupled to heat-generating components and a heat output side that is exposed externally. This design includes edge tabs overmolded into the housing, ensuring structural integrity and efficient heat transfer. The heat input side is characterized by multiple heat transfer regions at varying elevations, allowing for optimized thermal contact with components of different heights.
Additionally, the patent outlines the construction of an optical transceiver module that incorporates this innovative housing. The module includes a transmitter optical subassembly (TOSA) and a receiver optical subassembly (ROSA), both housed within the transceiver structure. The vapor chamber is made from heat-conducting materials such as copper, aluminum, or titanium, and is designed to facilitate the transfer of heat via a working fluid, which vaporizes and condenses to manage thermal loads effectively. The design also allows for the potential inclusion of a heatsink to further enhance heat dissipation. Overall, the patent presents a comprehensive solution for improving the thermal performance of optical transceiver modules, addressing the challenges posed by varying heat generation within compact electronic devices.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
