Advanced Micro Devices had one patents in connectivity during Q1 2024. The patent describes a semiconductor package with a mold layer encasing a photonic integrated circuit and a redistribution layer structure connecting the circuit to a semiconductor chip. Voids in the mold layer above the optical interface allow light transmission through the dielectric material. GlobalData’s report on Advanced Micro Devices gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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Advanced Micro Devices had no grants in connectivity as a theme in Q1 2024.
Recent Patents
Application: Fanout module integrating a photonic integrated circuit (Patent ID: US20240019649A1)
The semiconductor package described in the patent includes a structure with a first mold layer encasing a photonic integrated circuit and a redistribution layer providing electrical pathways between the semiconductor chip and the photonic integrated circuit. The second mold layer has voids above the optical interface of the photonic integrated circuit to allow light transmission through the dielectric material. The package ensures that the optical interface of the photonic integrated circuit remains unobstructed by the semiconductor chip, allowing for efficient optical coupling and transmission.
Additionally, the semiconductor package can include features such as optical couplings above the optical interface, dielectric layers with light transmissible materials, and through-silicon vias connecting different surfaces of the photonic integrated circuit. The method of fabricating the semiconductor package involves mounting the photonic integrated circuit and semiconductor chip in a specific configuration to ensure the unobstructed optical interface. Encapsulant material is deposited to encase the semiconductor chip, with voids defined to expose the optical interface, and optical couplings can be mounted above the interface for enhanced optical performance. Overall, the patent describes a semiconductor package design that optimizes light transmission and optical functionality in integrated circuits.
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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
