Knowles has filed a patent for a microelectromechanical systems (MEMS) device. The device includes a MEMS die with two diaphragms, multiple electrodes on each diaphragm, and a fixed dielectric element with apertures. The die also has a third set of electrodes and a conductive pin that connects the first and second conductive layers. The MEMS die generates signals based on changes in capacitance caused by the movement of the diaphragms. GlobalData’s report on Knowles gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile, Knowles's grant share as of September 2023 was 47%. Grant share is based on the ratio of number of grants to total number of patents.
A mems device with multiple diaphragms and electrodes
A recently filed patent (Publication Number: US20230294977A1) describes a microelectromechanical systems (MEMS) die that includes two diaphragms, each with a plurality of electrodes. The diaphragms are separated by a fixed dielectric element with apertures. The MEMS die also includes a third set of electrodes, with conductive layers on each diaphragm connected by a conductive pin that passes through the apertures. This configuration allows the MEMS die to generate signals based on changes in capacitance resulting from the movement of the diaphragms.
The patent also describes various embodiments and applications of the MEMS die. For example, claim 2 states that the fixed dielectric element is free of conductive layers. Claim 3 specifies that subsets of the electrodes are electrically connected to each other. Claim 4 adds that the diaphragms have connector pads on their second sides, which are electrically connected to subsets of the electrodes.
Furthermore, the patent discusses the integration of the MEMS die into a MEMS device. Claim 5 describes a MEMS device that includes the MEMS die, a voltage source connected to subsets of the electrodes, and a differential amplifier with inputs connected to subsets of the electrodes. Claim 8 introduces the concept of a housing for the MEMS device, with a base, a cover, and a port for pressure waves to enter the interior.
Additional claims highlight specific features of the MEMS die, such as the presence of a low-pressure region between the diaphragms (claim 6), a sealed tunnel providing fluid communication between the diaphragms (claim 7), and the use of strips with a length to width ratio of at least 5 to 1 for the electrodes and conductive layers (claim 10).
Overall, this patent describes a MEMS die with multiple diaphragms, electrodes, and a fixed dielectric element, which can generate signals based on changes in capacitance. The patent also explores various embodiments and applications of the MEMS die, including its integration into a MEMS device and the use of specific features to enhance its performance.
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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
