MegaChips has patented a process for bonding electrical contacts on different wafers using an oxide-inhibiting material to prevent surface oxidation. The apparatus involves melting the material to form a bond region with a different material constituency. The first contact is aluminum-based while the second contact is silicon-based. GlobalData’s report on MegaChips gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on MegaChips, Cloud gaming was a key innovation area identified from patents. MegaChips's grant share as of January 2024 was 49%. Grant share is based on the ratio of number of grants to total number of patents.
Wafer bonding using oxide-inhibiting material
A recently granted patent (Publication Number: US11869870B1) discloses an innovative apparatus comprising a first die with a first electrical contact and a second die with a second electrical contact. The apparatus is fabricated using a unique process involving an oxide-inhibiting material that is melted to form a bond region between the two electrical contacts. This bond region has a material constituency different from the individual electrical contacts, enhancing the overall functionality of the apparatus. The first electrical contact can be made of aluminum or various mixtures, while the second electrical contact can be silicon, germanium, or a mixture of silicon-germanium, adding versatility to the design.
Furthermore, the patent details the fabrication process, including the application of force to bring the electrical contacts together during the melting of the oxide-inhibiting material. The bond region formed is described as a eutectic bond, ensuring a strong and reliable connection between the first and second dies. The oxide-inhibiting material used in the process includes various noble metals and alloys like gold and silver, highlighting the importance of material selection in achieving the desired bond characteristics. Additionally, the patent covers variations of the apparatus, such as configurations where one die features a microelectromechanical system (MEMS) structure and the other a complementary metal-oxide-semiconductor (CMOS) structure, showcasing the adaptability of the technology across different applications.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
