Micron Technology. has filed a patent for methods, systems, and devices for connection designs in memory systems. The invention involves a memory system with a package, PCB, springs for electrical connection, and latches for mechanical connection. The design aims to improve the stability and performance of memory systems. GlobalData’s report on Micron Technology gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Micron Technology, 3D memory devices was a key innovation area identified from patents. Micron Technology's grant share as of January 2024 was 68%. Grant share is based on the ratio of number of grants to total number of patents.
Memory system connection design using springs and latches
The patent application (Publication Number: US20240039185A1) describes an apparatus comprising a package with a memory device and a first interface, a printed circuit board with a set of springs coupled with the package's first interface, and a set of latches to secure the package in place on the circuit board. The apparatus allows for secure and stable positioning of the memory device for efficient communication and operation.
Furthermore, the patent application details a method associated with the apparatus, involving receiving activation and access commands to open memory cells for access operations, accessing specific memory cells via the set of springs and the first interface, and receiving precharge commands to close memory cells after access. The method ensures smooth and controlled access to memory cells within the device, enhancing operational efficiency and data management. Overall, the apparatus and method outlined in the patent application aim to optimize memory device functionality and communication through innovative design elements and operational processes.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
