Powertech Technology has been granted a patent for a package structure that includes a first die, encapsulant, circuit structures, conductive connector, second die, and filler. The second die has an optical signal transmission area and is connected to the circuit structures. The filler is placed between the second die and the circuit structures, with direct contact to one area and being away from another area. The patent aims to improve the package structure for better optical signal transmission. GlobalData’s report on Powertech Technology gives a 360-degree view of the company including its patenting strategy. Buy the report here.
According to GlobalData’s company profile on Powertech Technology, Under-screen biometric identification was a key innovation area identified from patents. Powertech Technology's grant share as of September 2023 was 55%. Grant share is based on the ratio of number of grants to total number of patents.
Package structure with encapsulated die, circuit structures, and filler

A recently granted patent (Publication Number: US11769763B2) describes a package structure for electronic devices. The structure includes a first die covered by an encapsulant with two molding surfaces. On the first molding surface, there is a first redistributed circuit structure, while the second molding surface has a second redistributed circuit structure that is electrically connected to the first die. A conductive connector penetrates through the encapsulant and connects the first and second redistributed circuit structures. Additionally, a second die is placed on the second redistributed circuit structure and is electrically connected to it. The second die has an optical signal transmission area. Between the second die and the second redistributed circuit structure, there is a filler that directly contacts a specific area on the upper surface of the second redistributed circuit structure. Importantly, the filler is positioned away from another area on the upper surface, ensuring that the optical signal transmission area of the second die does not overlap with the encapsulant in a perpendicular direction.
The package structure may also include a plurality of second-die connectors located between the second die and the second redistributed circuit structure. In this case, the filler is arranged in a ring-shaped groove that surrounds the second-die connectors. The second redistributed circuit structure consists of a top insulating layer with a groove penetrating through it and a top conductive layer embedded in the insulating layer. The sidewall of the groove can be a slope or have a stepped structure. In some embodiments, the groove exposes a surface of a dummy pad in the second redistributed circuit structure.
The patent also discloses a manufacturing method for the package structure. The method involves providing a preliminary structure with a first die, encapsulant, first and second redistributed circuit structures, and a conductive connector. A second die is then placed on the preliminary structure and electrically connected to the second redistributed circuit structure. A filler is formed between the second die and the second redistributed circuit structure, directly contacting a specific area on the upper surface of the second redistributed circuit structure. The filler is positioned away from another area to prevent overlap with the encapsulant in a perpendicular direction. The method may include forming the second redistributed circuit structure by creating a groove in a top insulating material layer, which can be applied on a dummy pad. After forming the groove, the preliminary structure can be cut into multiple structures.
Overall, this patent presents a package structure and a manufacturing method that allow for efficient electrical connections and optical signal transmission in electronic devices.
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