Soitec has been granted a patent for a hybrid structure for a surface acoustic wave device. The structure includes a support substrate with a lower coefficient of thermal expansion than the working layer, and an intermediate layer made of a composite of two different materials fused together. GlobalData’s report on Soitec gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Soitec, 3D memory devices was a key innovation area identified from patents. Soitec's grant share as of April 2024 was 52%. Grant share is based on the ratio of number of grants to total number of patents.
Hybrid structure for surface acoustic wave device with composite layer
A recently granted patent (Publication Number: US11974505B2) discloses a hybrid structure for a surface acoustic wave device. The structure includes a support substrate, a working layer of piezoelectric material, and an intermediate layer made of a composite layer with grains of different materials fused together. The support substrate has a lower coefficient of thermal expansion than the working layer, ensuring stability and performance of the device.
Furthermore, the patent claims specify that the first material in the composite layer has a similar acoustic impedance to the working layer, while the second material has an acoustic impedance ratio greater than 2. The size of particles in the composite layer is carefully controlled to optimize the propagation of acoustic signals on the surface of the device. Materials for the support substrate and working layer are selected from a range including silicon, glass, quartz, and zinc oxide, highlighting the versatility and applicability of the hybrid structure in various technological applications.
To know more about GlobalData’s detailed insights on Soitec, buy the report here.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
