STMicroelectronics had 26 patents in advanced materials during Q1 2024. STMicroelectronics NV filed patents for an integrated circuit package with shape memory materials, a MEMS ultrasonic transducer device with modulation and transduction membranes, a transducer with piezoelectric transducers on suspended structures, and a differential piezoelectric actuator-system with control circuitry for energy transfer phases. GlobalData’s report on STMicroelectronics gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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STMicroelectronics grant share with advanced materials as a theme is 30% in Q1 2024. Grant share is based on the ratio of number of grants to total number of patents.
Recent Patents
Application: Integrated circuit package (Patent ID: US20240079363A1)
The integrated circuit package described in the patent filed by STMicroelectronics NV includes a support substrate and a cover defining a housing for an electronic integrated circuit chip. The chip has electrically conductive protruding elements on one face that are connected to the support substrate's contact pads via a shape memory material. This material is thermally conductive and contains a nickel-titanium alloy, with specific compositions and properties outlined in the claims.
The manufacturing method for this integrated circuit package involves deforming and depositing shape memory materials on the chip and contact pads, flipping the chip to establish electrical connections, and fastening a cover. Heating the structure causes the shape memory materials to expand, applying pressure to ensure proper contact. The method also includes using a second shape memory material on the chip's opposite face, with similar composition and expansion properties as the first material, to further enhance the package's performance and reliability.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
