Teradyne’s patented printed circuit board (PCB) design includes layers of dielectric material, conductive traces, and vias for signal transmission. The innovative layout incorporates ground layers positioned at specific distances to optimize signal integrity and reduce interference. GlobalData’s report on Teradyne gives a 360-degree view of the company including its patenting strategy. Buy the report here.

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According to GlobalData’s company profile on Teradyne, Robot path planning was a key innovation area identified from patents. Teradyne's grant share as of May 2024 was 48%. Grant share is based on the ratio of number of grants to total number of patents.

Patent granted for printed circuit board with conductive trace

Source: United States Patent and Trademark Office (USPTO). Credit: Teradyne Inc

A recently granted patent (Publication Number: US12004288B2) discloses a printed circuit board (PCB) design that includes a substrate made up of layers of dielectric material, a conductive trace, a conductive via, and ground layers. The conductive trace runs parallel to the layers of dielectric material and is connected to a signal input via the conductive via. The ground layers, located at specific distances from the conductive trace, are designed to reflect signals and connect to a reference ground voltage. The PCB design aims to optimize signal transmission and minimize interference by utilizing specific layer thicknesses and configurations.

Furthermore, the patent describes how the PCB design can be used in a system involving a device interface board (DIB) for testing devices under test (DUTs). The DIB, constructed with similar PCB features including ground vias and conductors, acts as an interface between the DUTs and a test instrument. By incorporating specific ground layer configurations and impedance matching conductors, the system aims to enhance signal integrity and minimize signal loss during testing procedures. The innovative PCB design and system configuration outlined in the patent offer potential improvements in signal transmission efficiency and reliability in testing environments.

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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.

GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.