Texas Instruments had two patents in 3D printing during Q2 2024. Texas Instruments Inc filed a patent for an integrated circuit with a polymer structure coated with metal, and a device electrically coupled to a semiconductor die. Another patent involves a method of forming a layer of additive material on a substrate using additive sources distributed in a printing zone, with actuation waveforms at a frequency proportional to the distance from the center of rotation. GlobalData’s report on Texas Instruments gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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Texas Instruments had no grants in 3D printing as a theme in Q2 2024.
Recent Patents
Application: 3d printed semiconductor package (Patent ID: US20240145526A1)
The patent filed by Texas Instruments Inc. describes an integrated circuit that includes a substrate, a semiconductor die, and a device on the substrate that is electrically coupled to the semiconductor die. The device is characterized by a polymer structure coated with a metal. This innovative design allows for improved performance and functionality of the integrated circuit.
Furthermore, the integrated circuit may also include an encapsulation material that encapsulates the semiconductor die and the device. The encapsulation material, which may include a resin, serves to protect the components and ensure their reliability. Additionally, the device within the integrated circuit can be customized to include components such as inductors or antennas, providing versatility in its applications. Overall, this patent showcases advancements in integrated circuit technology that enhance performance and reliability.
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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
